lihlahisoa

3d Scanner e tšoaroang ka letsoho- 3DSHANDY-22LS

Tlhaloso e Khutšoanyane:

3DSHANDY-22LS ke sekena sa 3d se tšoaroang ka letsoho se boima bo bobebe (0.92kg) 'me se bonolo ho se jara.

Lithapo tse 14 tsa laser + sekoting se tebileng sa 1 sa 1 + maballo a eketsehileng a 7 ho hlahloba lintlha, kakaretso ea mela e 22 ea laser.

Lebelo le potlakileng la ho skena, ho nepahala ho phahameng, botsitso bo matla, lik'hamera tse peli tsa indasteri, theknoloji ea othomathike ea ho kopanya li-marker le software e iketselitseng ea ho skena, ho nepahala ha ultra-high le katleho ea mosebetsi.

Sehlahisoa sena se 'nile sa sebelisoa haholo lefapheng la boenjiniere ba morao-rao le tlhahlobo ea likarolo tse tharo. Ts'ebetso ea ho skena e bonolo ebile e bonolo, e loketse maemo a fapaneng a ts'ebeliso e rarahaneng.


Lintlha tsa Sehlahisoa

Paramethara

Linyeoe tsa Kopo

Li-tag tsa Sehlahisoa

Kenyelletso ea sesebelisoa sa laser 3D se tšoaroang ka letsoho

3DSHANDY-22LS Litšobotsi

3DSHANDY-22LS e amohela moralo oa morao-rao o tšoaroang ka letsoho, o na le boima bo bobebe (0.92kg), mme e se e loketse ho sebelisoa.

E na le mela e 14 ea laser + e 'ngoe e eketsehileng ea 1 beam e hlahlobang sekoti se tebileng + boriti bo eketsehileng bo 7 ho hlahloba lintlha, kakaretso ea mela e 22 ea laser.

E na le lebelo la ho skena ka potlako, ho nepahala ho phahameng, botsitso bo matla, lik'hamera tse peli tsa indasteri, theknoloji ea "automatic marker splicing", software e iketselitseng ea ho skena, le ho nepahala ha ultra-high le katleho ea mosebetsi.

E 'nile ea sebelisoa haholo lefapheng la boenjiniere ba morao-rao le tlhahlobo ea likarolo tse tharo. Ts'ebetso ea ho skena e bonolo ebile e bonolo, e loketse maemo a fapaneng a ts'ebeliso e rarahaneng.

● Ho nepahala ho phahameng

Ho nepahala ha tekanyo ea mochine o le mong ho ka holimo ho 0.01mm, 'me lintho tse kholo le tse mahareng li ka hlahlojoa habonolo ntle le thuso ea photogrammetric system.

● Mohloli oa leseli

Mehala e 22 e putsoa ea laser, lebelo le potlakileng la ho skena le ho nepahala ho holimo

● Ho metha ka potlako

Palo ea lintlha tsa ho tšoaea e fokotsehile, mela e 14 ea laser + 1 ea botebo ba ho hlahloba + lintlha tse 7 tsa ho hlahloba

● Mokhoa o motle

Fetolela lipakeng tsa mokhoa o bonolo le o le mong oa laser ho hlahloba habonolo libaka tse rarahaneng le likhutlo tse shoeleng tsa masoba a tebileng

● Ho sebetsa habonolo

Moralo oa indasteri, boholo bo nyane, boima bo bobebe (0.92kg), e tenyetseha ebile e bonolo, e bonolo ho sebetsa, e ntlafatsa haholo ts'ebetso ea mosebetsi, lipatlisiso tse ncha tse ikemetseng le theknoloji ea nts'etsopele li tiisitsoe.

● Ho ikamahanya le maemo ho matla

Ts'ebetso e le 'ngoe ea letsoho, e sa angoeng ke tikoloho, ha e felle feela ke sebopeho sa workpiece le bokhoni ba mosebelisi

● Ho iponela ka mahlo ka nako ea sebele

Skrine ea komporo e bonts'a sebopeho sa ts'ebetso ka nako ea nnete ho lekola liphoso ka nepo le ho etsa tse siiloeng

● Moralo oa indasteri

Boima bo bobebe (0.92kg), bo bonolo ho bo jara, bo loketse ho bo sebelisa, bo sebetsa hantle haholo, lipatlisiso tse ikemetseng tsa morao-rao le theknoloji ea nts'etsopele li tiisitsoe.

Linyeoe tsa Kopo

Indasteri ea Likoloi

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· Tlhahlobo ea tlholisano ea lihlahisoa
· Phetoho ea koloi
· Mokhabiso customization
· Ho etsa mohlala le moralo
· Taolo ea boleng le tlhahlobo ea likarolo
· Ketsiso le tlhahlobo ea lintlha tse lekanyelitsoeng

Tooling Casting

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· Kopano ea sebele
· Reverse engineering
· Taolo ea boleng le tlhahlobo
· Tlhahlobo le tokiso ea moaparo
· Moralo oa li-jigs le li-fixtures,tokiso

Aeronautics

飞机模型

· Prototyping e potlakileng
· MRO le tlhahlobo ea tšenyo
· Aerodynamics & tlhahlobo ea khatello ea kelello
· Tlhahlobo & tokisoea ho kenya likarolo

Khatiso ea 3D

包装设计

· Tlhahlobo ea ho bopa
· Moralo oa morao oa ho bopa ho theha data ea CAD
· Qetella tlhahlobo ea papiso ea lihlahisoa
· Lintlha tse hlahlobiloeng li ka sebelisoa bakeng sa khatiso ea 3D ka kotloloho

Sebaka se seng

包装设计

· Lipatlisiso tsa thuto le saense
· Bongaka le bophelo bo botle
· Moralo oa morao
· Moralo oa indasteri


  • E fetileng:
  • E 'ngoe:

  • Mohlala oa sehlahisoa 3DSHANDY-22LS
    Mohloli oa leseli Mehala e 22 e putsoa ea laser (wavelength: 450nm)
    Lebelo la ho lekanya 1,320,000points/s
    Mokhoa oa ho skena Mokhoa o tloaelehileng Mohlala oa lesoba le tebileng Mokhoa o nepahetseng
    14 e tšetseng mela e putsoa ea laser Mohala o le mong oa laser e putsoa Mehala e 7 ea laser e bapileng
    Ho nepahala ha data 0.02 limilimithara 0.02 limilimithara 0.01 limilimithara
    Ho hlahloba sebaka 330 limilimithara 330 limilimithara 180 limilimithara
    Ho hlahloba botebo ba sebaka 550 limilimithara 550 limilimithara 200mm
    Qeto 0.01mm (boholo)
    Sebaka sa ho skena 600×550mm (boholo)
    Sebaka sa ho skena 0.1-10 m (e ka atoloswa)
    Ho nepahala ha molumo 0.02+0.03mm/m
    0.02+0.015mm/m E kopantsoe le HL-3DP 3D photogrammetry system (ho ikhethela)
    Tšehetso bakeng sa lifomate tsa data asc, stl, ply, obj, igs, wrl, xyz, txt joalo-joalo, u ka ikhethela
    Software e lumellanang 3D Systems (Geomagic Solutions), InnovMetric Software (PolyWorks), Dassault Systemes (CATIA V5 le SolidWorks), PTC (Pro/ENGINEER), Siemens (NX le Solid Edge), Autodesk (Inventor, Alias, 3ds Max, Maya, Softimage) , joalo-joalo.
    Phetiso ea data USB3.0
    Tlhophiso ea komporo (boikhethelo) Win10 64-bit; Mohopolo oa video: 4G; processor: I7-8700 kapa ka holimo; memori: 64 GB
    Boemo ba polokeho ea laser SehlophaⅡ (Tshireletso ea mahlo a motho)
    Nomoro ea netefatso (setifikeiti sa Laser): LCS200726001DS
    Boima ba lisebelisoa 920g
    Boemo ba kantle 290x125x70mm
    Mocheso / mongobo -10-40 ℃; 10-90%
    Mohloli oa matla Kenyelletso: 100-240v, 50/60Hz, 0.9-0.45A; Sephetho: 24V, 1.5A, 36W(max)

    300225 2 3 

    Ngola molaetsa wa hao mona mme o re romele wona