zvigadzirwa

Resin SZUV-T1150-yepamusoro tembiricha kuramba

Tsanangudzo Pfupi

Resin T1150 is high-temperature-resistance resin yeSLA 3D printer.

3D kudhinda zvinhu


Product Detail

Physical Properties (Liquid)

Mechanical Properties (Post-Cured)

Product Tags

3D Printing Materials

Kupisa kwepamusoro-T1150

General Sumo

Hunhu:

SZUV -T1150 ndeyeyero SL resin iyo isina kuenzana nekupisa kwekuita. Inogona kumira tembiricha inodarika 200 ℃ nenguva pfupi uye 120 ℃ panguva yakareba. Yakagadzirirwa kubata akasiyana siyana ekushisa kwepamusoro uye yakashata yekuyedza maapplication.

Dhinda zvinhu-yepamusoro tembiricha inodzivirira-T1150
Dhinda zvinhu-yepamusoro tembiricha inodzivirira-T1150

Typical Features

Kusimba Kwakakwirira uye Kupokana Kwakanaka

SZUV-T1150 inogona kusimudza humidity, mvura uye zvinonyungudutsa, senge peturu, transmission fluid, mafuta uye inotonhorera. Nekupisa kwayo kusingaenzaniswi, inokodzera kuyerera, HVAC, mwenje, zvishandiso, kuumba uye mhepo tunnel yekuyedza maapplication.

Vaka Nekukurumidza uye Gadzira Nekukurumidza

Nekupa kukurumidza kubuda uye zvikamu zvine nzvimbo yakatsetseka, iri nyore kubata, SZUV-T1150 inogona kupedzisa purojekiti yako kubva pakudhirowa kuenda kune yekuyedza zvikamu munguva pfupi pfupi.

Typical Application

-Under-the-hood chikamu chekuongorora

-High tembiricha RTV kuumba

-Wind tunnel yekuongorora

-Kuedza kugadzirisa magetsi

-Composite autoclave tooling

-HVAC chikamu chekuongorora

-Kutora bvunzo dzakawanda

- Orthodontics

耐高温3

Application Cases

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汽车配件
包装设计
艺术设计
医疗领域

Dzidzo

Hand Molds

Auto Parts

Packaging Design

Art Design

Medical


  • Zvakapfuura:
  • Zvinotevera:

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    Chitarisiko chena
    Density

    1.13g/cm3@25 ℃

    Viscosity

    430~510 cps @ 27 ℃

    Dp

    0.155 mm

    Ec

    7.3 mJ/cm2

    Kuvaka layer ukobvu

    0.05 ~ 0.12mm

     

    Kuyera

    Test Method

    Value

    90-miniti UV mushure mekurapa

    90-maminetsi UV +2 maawa@160℃ yekupisa post-kurapa

    Kuoma, Shore D ASTM D 2240 88 92
    Flexural modulus, Mpa ASTM D790 2776-3284 3601-3728
    Flexural simba, Mpa ASTM D790 63-84 92-105
    Tensile modulus, MPa ASTM D 638 2942-3233 3581-3878
    Kusimba simba, MPa ASTM D 638 60-71 55-65
    Elongation panguva yekuzorora ASTM D 638 4-7% 4-6%
    Impact simba, notched lzod, J/m ASTM D 256 12-23 11-19
    Heat deflection tembiricha, ℃ ASTM D 648 @66PSI 91 108
    Girazi shanduko, Tg, ℃ DMA, E'peak 120 132
    Coefficient yekuwedzera kwekupisa, E6/℃ TMA (T 78 85
    Thermal conductivity, W/m.℃   0.179  
    Density   1.26  
    Kutorwa kwemvura ASTM D 570-98 0.48% 0.45%

     

     

     

     

     

     

     

     

     

     

     

     

     

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